Method for manufacturing a phase change memory device having a second opening above a first opening in the dielectric layer

ABSTRACT

A phase change memory device includes a bottom electrode, a bottom memory layer, a top memory layer, and a top electrode. The bottom memory layer is over the bottom electrode. The bottom memory layer has a first height and includes a tapered portion and a neck portion. The tapered portion has a second height. A ratio of the second height to the first height is in a range of about 0.2 to about 0.5. The neck portion is between the tapered portion and the bottom electrode. The top memory layer is over the bottom memory layer. The tapered portion of the bottom memory layer tapers in a direction from the top memory layer toward the neck portion. The top electrode is over the top memory layer.

BACKGROUND

Phase change memory (PCM) is a type of non-volatile memory in which thestate of a function area in the phase change material is switchedbetween crystalline and amorphous, e.g., by a current flow thatgenerates heat. The state of the function area is then used to representthe stored data. For example, after a heat excitation if the functionarea is in the crystalline state, the stored data is a low logic level(e.g., a Low). But if the function area is in the amorphous state, thestored data is a high logic level (e.g., a High). Phase change memory isalso known as phase random access memory (PRAM), phase change randomaccess memory (PCRAM), ovonic unified memory, chalcogenide random accessmemory (or C-RAM), etc.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 is a perspective view of a memory device in accordance withvarious embodiments of the present disclosure.

FIGS. 2A and 2B are a flowchart of a method for making a memory deviceaccording to aspects of the present disclosure in various embodiments.

FIGS. 3A-3N illustrate cross-sectional views for making the memorydevice at different stages according to aspects of the presentdisclosure in various embodiments.

FIG. 4 is an enlarged view of area P in FIG. 3N.

FIG. 5 is a cross-sectional view of a memory device according to someembodiments.

FIG. 6 is an enlarged view of area N in FIG. 5.

FIGS. 7A and 7B are a flowchart of a method for making a memory deviceaccording to aspects of the present disclosure in various embodiments.

FIGS. 8A-81 illustrate cross-sectional views along the line A-Aillustrated in FIG. 1.

FIG. 9 is an enlarged view of area P′ in FIG. 8I.

FIG. 10 is a cross-sectional view of a memory device according to someembodiments.

FIG. 11 is an enlarged view of area N′ in FIG. 10.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

As used herein, “around”, “about”, “approximately”, or “substantially”shall generally mean within 20 percent, or within 10 percent, or within5 percent of a given value or range. Numerical quantities given hereinare approximate, meaning that the term “around”, “about”,“approximately”, or “substantially” can be inferred if not expresslystated.

This disclosure relates to memory device fabrications and morespecifically to phase change memory (PCRAM) formations by forming afunnel shape phase change layer. Because of the funnel shape phasechange layer, a memory device with high phase change efficiency can beformed. Such structure and its method does not add area burden to thedevice and thus enhances an efficient use of substrate area for higherdensity devices.

FIG. 1 is a perspective view of a memory device in accordance withvarious embodiments of the present disclosure. The memory deviceincludes a bottom electrode 180, a bottom memory layer 190, a top memorylayer 210, and a top electrode 230. The bottom memory layer 190 is overthe bottom electrode 180. The top memory layer 210 is over the bottommemory layer 190. The top electrode 230 is over the top memory layer210. In some embodiments, the bottom memory layer 190 is directly on (orin contact with) the bottom electrode 180, the top memory layer 210 isdirectly on (or in contact with) the bottom memory layer 190, and/or thetop electrode 230 is directly on (or in contact with) the top memorylayer 210. The top memory layer 210 covers the bottom memory layer 190.That is, a bottom surface area of the top memory layer 210 is greaterthan a top surface area of the bottom memory layer 190. The bottommemory layer 190 has a funnel shape. That is, a top width of the bottommemory layer 190 is greater than a bottom width of the bottom memorylayer 190. Or, the bottom memory layer 190 tapers in a direction fromthe top memory layer 210 toward the bottom electrode 180. During thememory operation, the current flows from the top electrode 230 towardsthe bottom electrode 180 through the top memory layer 210 and the bottommemory layer 190. Since the bottom memory layer 190 has the funnelshape, the current density is increased in the bottom (neck) portion ofthe bottom memory layer 190. As such, the heat generated from thecurrent is concentrated in the bottom portion of the bottom memory layer190. The concentrated heat in the bottom portion of the bottom memorylayer 190 lowers the threshold voltage for the memory operation. Assuch, the size of the memory cell can be reduced.

In FIG. 1, the bottom electrode 180, the bottom memory layer 190, thetop memory layer 210, and the top electrode 230 form a memory cell. InFIG. 1, the memory device includes six memory cells arranged as anarray. In some embodiments, the memory cell may be a phase change randomaccess memory (PCRAM) or other suitable memory cell.

In FIG. 1, the memory cells are formed over a wafer 110 including asubstrate 112 and a circuit 114 formed over the substrate 112. Thememory cells may be formed in a logic region or a memory region of thewafer 110. Furthermore, one or more inter-metal dielectric (IMD) layer120 may be formed between the wafer 110 and the memory cells. The IMD120 may be an interconnection between the circuit 114 and the memorycells.

Moreover, the memory device further includes bottom conductive lines 130and top conductive lines 250. The bottom conductive lines 130 arearranged in a first direction and are connected to the bottom electrodes180. The top conductive lines 250 are arranged in a second directiondifferent from the first direction and are connected to the topelectrodes 230. In some embodiments, the first direction issubstantially perpendicular to the second direction.

The memory device further includes a first dielectric layer 140, an etchstop layer 150, a second dielectric layer 160, a third dielectric layer220, and a fourth dielectric layer 240 (all represented by dashed linesfor clarity). The first dielectric layer 140 is over the IMD 120 andsurrounds the bottom conductive lines 130. The etch stop layer 150 andthe second dielectric layer 160 are sequentially over the firstdielectric layer 140. The etch stop layer 150 surrounds the bottomelectrodes 180, and the second dielectric layer 140 surrounds the bottomelectrodes 180 and the bottom memory layer 190. The third dielectriclayer 220 is over the second dielectric layer 160 and surrounds the topmemory layer 210 and the top electrodes 230. The fourth dielectric layer240 is over the third dielectric layer 220 and surrounds the topconductive lines 250. In some embodiments, the etch stop layer 150 isdirectly on (or in contact with) the first dielectric layer 140, thesecond dielectric layer 160 is directly on (or in contact with) the etchstop layer 150, the third dielectric layer 220 is directly on (or incontact with) the second dielectric layer 160, and/or the fourthdielectric layer 240 is directly on (or in contact with) the thirddielectric layer 220.

FIGS. 2A and 2B are a flowchart of a method M10 for making a memorydevice according to aspects of the present disclosure in variousembodiments. Various operations of the method M10 are discussed inassociation with cross-section diagrams FIGS. 3A-3N, where illustratecross-sectional views along the line A-A illustrated in FIG. 1.Throughout the various views and illustrative embodiments, likereference numbers are used to designate like elements. In operation S12of method M10, a wafer 110 having a substrate 112 and a circuit 114formed over the substrate 112 is provided, as shown in FIG. 3A. Thesubstrate 112 may be a silicon substrate. Alternatively, the substrate112 may include another elementary semiconductor, such as germanium; acompound semiconductor including silicon carbide; an alloy semiconductorincluding silicon germanium; or combinations thereof. In someembodiments, the substrate 112 is a semiconductor on insulator (SOI)substrate. The substrate 112 may include doped regions, such as p-wellsand n-wells. In some embodiments, the wafer 110 is a workpiece thatincludes the substrate 112 and various features formed in and over andattached to the substrate 112. In some embodiments, the circuit 114includes transistors formed by transistor fabrication processes and maybe a planar transistor, such as polysilicon gate transistors or high-kmetal gate transistors, or a multi-gate transistor, such as fin fieldeffect transistors. After the transistors are formed, one or moremetal/dielectric layers of a multi-level interconnect (MLI) is formedover the transistors. According to some embodiments, pluralmetal/dielectric layers are formed over the transistors. In someembodiments, the circuit 114 may be a logic circuit or a memory circuit.

In operation S14 of method M10 in FIG. 2A, at least one IMD layer 120 isformed over the wafer 110, as shown in FIG. 3A. The IMD layer 120 mayprovide electrical interconnection between the memory cells and thecircuit 114 as well as structural support for the various features ofthe memory device during many fabrication process operations, some ofwhich will be discussed herein. For example, the IMD layer can act asstructural support for memory cells formed thereon. Specifically, thememory cells are formed over the IMD layer 120 as shown in FIG. 1. Insome embodiments, the IMD layer 120 may be silicon oxide, low-k siliconoxide such as a porous silicon oxide layer, other suitable interlayerdielectric (ILD) material, other suitable inter-metal dielectricmaterial, combinations thereof, or the like. In some embodiments, theIMD layer 120 is a low-k dielectric layer made from extra low-kmaterials, extreme low-k materials, combinations thereof, or the like.In some embodiments, the IMD layer 120 may have a dielectric constantlower than 2.4. In some embodiments, the IMD layer 120 is made usingdiethoxymethylsilane (mDEOS) or the like as a precursor gas in achemical vapor deposition (CVD) process. However, other low-k dielectricmaterials may be used as well. The IMD layer 120 also includesconductive elements for interconnecting the memory cells and the circuit114.

In operation S16 of method M10 in FIG. 2A, at least one bottomconductive line 130 is formed over the IMD layer 120, as shown in FIG.3A. In some embodiments, the bottom conductive line 130 is formed ofcopper or copper alloys. In some other embodiments, the bottomconductive line 130 may be formed of conductive materials such asaluminum, tungsten, carbon, TaN, or other suitable materials. In stillsome other embodiments, the bottom conductive line 130 may be a bilayerstructure (e.g., a TaN layer and a TiN layer formed on the TaN layer).In some embodiments, a first dielectric layer 140 is formed over the IMDlayer 120, and at least one trench 142 is formed in the first dielectriclayer 140 to expose the IMD layer 120. The bottom conductive line 130 isthen formed in the trench 142. In some embodiments, the first dielectriclayer 140 may include, for example, silicon oxide, low-k silicon oxidesuch as a porous silicon oxide layer, other suitable dielectricmaterial, combinations thereof, or the like. In FIGS. 1 and 3A, thebottom conductive line 130 extends in a first direction.

In operation S18 of method M10 in FIG. 2A, an etch stop layer 150 and asecond dielectric layer 160 are sequentially formed over the bottomconductive line 130 and the first dielectric layer 140, as shown in FIG.3B. The etch stop layer 150 is deposited over the bottom conductive line130 and the first dielectric layer 140. The etch stop layer 150 mayinclude a metal nitride, a metal carbide, a metal oxide, combinationsthereof, and/or the like, wherein the metal may include tungsten (W),aluminum (Al), manganese (Mn), Copper (Cu), or multi-layers thereof. Theetch stop layer 150 is formed of a material that has a high etchingselectivity with the second dielectric layer 160, and hence the etchstop layer 150 may be used to stop the etching of second dielectriclayer 160. The second dielectric layer 160 may include, for example,silicon oxide, low-k silicon oxide such as a porous silicon oxide layer,other suitable dielectric material, combinations thereof, or the like.The second dielectric layer 160 is deposited over the etch stop layer150.

In operation S20 of method M10 in FIG. 2A, at least one first bottomopening 162 is formed in the second dielectric layer 160, as shown inFIG. 3C. For example, a patterned photoresist PR1 is formed over thestructure of FIG. 3B, i.e., over the second dielectric layer 160, suchthat the photoresist PR1 exposes a portion of the second dielectriclayer 160. In some embodiments, a photoresist material may be formedover the second dielectric layer 160 by using spin-coating or othersuitable techniques, and the photoresist material is patterned to formthe photoresist PR1. The photoresist PR1 has at least one opening O1which exposes the second dielectric layer 160. Then, the seconddielectric layer 160 is patterned (etched) using the photoresist PR1 asa mask to form the first bottom opening 162 in the second dielectriclayer 160. The first bottom opening 162 is a blind hole, which meansthat the first bottom opening 162 does not extend to the etch stop layer150. The first bottom opening 162 has a depth D1 smaller than athickness 160 t of the second dielectric layer 160. In some embodiments,the depth D1 of the first bottom openings 162 is greater than half ofthe thickness 160 t of the second dielectric layer 160. In someembodiments, the first bottom opening 162 has a width W1. Sharp corners169 are formed at the interconnection between the top surface of thesecond dielectric layer 160 and a sidewall of the first bottom opening162.

In operation S22 of method M10 in FIG. 2A, at least one second bottomopening 164 is formed over the first bottom opening 162, as shown inFIG. 3D. In other words, top portions of the first bottom openings 162are widened, and/or the sharp corner 169 (see FIG. 3C) is removed orrounded. Specifically, a photoresist trimming process is performed onthe photoresist PR1 to widen the opening O1′. In some embodiments, thephotoresist trimming process may be an etching process. As such, theopening O1′ further exposes another portion of the top surface of thesecond dielectric layer 160. Then, the exposed portions of the seconddielectric layer 160 are then patterned (etched) to form second bottomopenings 164 over the first bottom openings 162. During this operation,the first bottom openings 162 are deepened to expose the etch stop layer150. The second bottom openings 164 may be formed by performing anetching process, such as dry etching, wet etching, or combinationsthereof. In some embodiments, the etching process is a dry etchingprocess using etching gases as CH₂F₂ and/or HBr. Further, He may beadded in the etching gases in some embodiments.

In greater detail, the second bottom opening 164 overlaps the firstbottom opening 162. The first bottom opening 162 has a width W1′ and adepth D1′. The width W1′ is substantially the same as the width W1 inFIG. 3C, and the depth D1′ is greater than the depth D1 in FIG. 3C andis substantially the same as the thickness 160 t of the seconddielectric layer 160. The second bottom opening 164 has a width W2 and adepth D2. The width W2 of the second bottom opening 164 is greater thanthe width W1′ of the first bottom opening 162, and the depth D2 of thesecond bottom opening 164 is less than the depth D1′ of the first bottomopening 162.

In some embodiments, the depth D2 may be in a range of about 2 nm toabout 20 nm. If the depth D2 is less than 2 nm, the second bottomopening 164 is not easy to be formed, and the sharp corner 169 (see FIG.3C) may not be removed or rounded. If the depth D2 is greater than about20 nm, the whole first bottom opening 162 may be replaced with thesecond bottom opening 164, and the whole bottom opening may have abigger critical dimension (CD). Further, the sharp corner may be formedaround the second bottom opening 164. In some embodiments, the width W2may be in a range of about 50 nm to about 300 nm. If the width W2 isless than about 50 nm, the first bottom opening 162 may not be widened.If the width W2 is greater than about 300 nm, the layout area of eachmemory cell may be increased.

In operation S24 of method M10 in FIG. 2A, the etch stop layer 150 ispatterned to expose the bottom conductive line 130, as shown in FIG. 3E.During this process, the second bottom openings 164 are deepened.Specifically, the photoresist PR1 in FIG. 3D is removed by usingstripping or ashing process, and then a selectively etching process isperformed. The etch stop layer 150 is selectively etched while thesecond dielectric layer 160 and the bottom conductive line 130 arebarely etched or etched relatively slow. The patterning of the etch stoplayer 150 is performed with a first selectivity between the removal rateof the etch stop layer 150 and the removal rate of the second dielectriclayer 160, with the removal rate of the etch stop layer 150 is greaterthan the removal rate of the second dielectric layer 160. Assuming theremoval rate of the etch stop layer 150 is RR1, and the removal rate ofthe second dielectric layer 160 is RR2, the first selectivity, which isRR1/RR2, may be greater than about 10, and may also be between about 10and about 100 in some exemplary embodiments. Also, the patterning of theetch stop layer 150 is performed with a second selectivity between theremoval rate of the etch stop layer 150 and the removal rate of thebottom conductive lines 130, with the removal rate of the etch stoplayer 150 is greater than the removal rate of the bottom conductivelines 130. Assuming the removal rate of the etch stop layer 150 is RR1,and the removal rate of the bottom conductive lines 130 is RR3, thesecond selectivity, which is RR1/RR3, may be greater than about 100, andmay also be between about 100 and about 1000 in some exemplaryembodiments. It is appreciated, however, that the values recitedthroughout the description are merely examples, and may be changed todifferent values.

In some embodiments, the selectively etching process may be a dryetching process using etching gases such as C₄F₈, C₄F₆, combinationsthereof, or the like. In some other embodiments, Ar, He, or othersuitable gases may be added into the etching process. The etching periodmay be in a range of about 20 seconds to about 100 seconds. If theetching period is lower than about 20 seconds, the etch stop layer 150may not be etched to the bottom. If the etching period is greater thanabout 100 seconds, the etch stop layer 150 may be over etched. In someembodiments, the amount of C₄F₈ gas is greater than the amount of C₄F₆gas to obtain the second bottom opening 164 having a concave upwardsidewall. In other words, the gas ratio of C₄F₈/C₄F₆ is greater thanabout 1 in this case.

Moreover, during this process, since the etching gases have high etchingselectivity between the etch stop layer 150 and the bottom conductiveline 130, the etching gases is not easy to etch the bottom conductiveline 130 when the etch stop layer 150 is patterned to expose the bottomconductive line 130. Instead, the etching gases remain in the firstbottom opening 162′ and the second bottom opening 164′ and start to etchthe second dielectric layer 160 since the first selectivity (between theetch stop layer 150 and the second dielectric layer 160) is lower thanthe second selectivity (between the etch stop layer 150 and the bottomconductive line 130). Since the second bottom opening 164′ has largersurface area than the first bottom opening 162′, the second bottomopening 164′ is etched (widened and/or deepened) faster than the firstbottom opening 162′. Furthermore, since the etch stop layer 150 is thinenough, the etching gases are not easy to over etch the etch stop layer150 while the etching gases etch the second dielectric layer 160.

In FIG. 3E, the selectively etching process is performed to form thefirst bottom opening 162′ and the second bottom opening 164′. The firstbottom opening 162′ extends to the top surface of the bottom conductiveline 130, and has a depth D3 substantially the same as the depth D1′(see FIG. 3D) (since the etch stop layer 150 is thin). The second bottomopening 164′ has a depth D4 deeper than the depth D2 (see FIG. 3D) and aratio of depths D4/D3 is in a range of about 0.2 to about 0.5. In FIG.3E, the first bottom opening 162′ and the second bottom opening 164′ aretogether referred to as a bottom opening BO, which is funnel shaped.

In operation S26 of method M10 in FIG. 2A, a surface cleaning process isperformed in the bottom opening BO, as shown in FIG. 3F. Specifically,during the selectively etching process, when the bottom conductive line130 is exposed, a metal oxide layer may be formed on the exposed topsurface thereof. As such, the surface cleaning process may be performedon the bottom conductive line 130 exposed by the bottom opening BO toremove the metal oxide layer. In some embodiments, the surface cleaningprocess may be performed by providing H₂ gases to the bottom opening BO.The H₂ gases will react with the metal oxide layer, such that the metaloxide layer is removed to expose the conductive material of the bottomconductive line 130. For example, the bottom conductive line 130 may bemade of copper, and the metal oxide layer is copper oxide. The H₂ gasesreact with the copper oxide to remove the oxide from copper, such thatthe (pure) copper is exposed by the bottom opening BO. In someembodiments, the surface cleaning process may be performed for about 20seconds or longer. Moreover, the selectively etching process inoperation S24 may form rough sidewalls on the bottom opening BO, the H₂gases also help forming a polymer layer 170 (not shown in FIG. 1 forclarity) on the sidewalls of the bottom opening BO, such that thesidewalls of the bottom opening BO become smooth. The smooth sidewall isgood for the electron migration sustain in the following formed bottomelectrode 180 and the bottom memory layer. In some embodiments, thepolymer layer 170 may include SiClO_(x), SiBrO_(x), CH_(x), orcombinations thereof. Further, the polymer layer 170 may have athickness in a range of about 1 nm to about 2 nm.

In operation S28 of method M10 in FIG. 2B, a bottom electrode 180 isformed in the bottom opening BO, as shown in FIG. 3G. The bottomelectrode 180 is formed in the bottom opening BO and over the polymerlayer 170. The bottom electrode 180 is electrically connected to thebottom conductive line 130. Since the native oxide layer over the bottomconductive line 130 has been removed, the bottom electrode 180 and thebottom conductive line 130 have well electrically connection, good forRC-delay of the formed memory device. In some embodiments, a fillinglayer is formed on the second dielectric layer 160 and in the bottomopening BO, and excessive portions of the filling layer is removed byperforming a CMP process to form the bottom electrode 180. The bottomelectrode 180 can be made of Ti, TiN, or other suitable materials. Insome embodiments, a barrier layer may be formed between the bottomelectrode 180 and the second dielectric layer 160. The barrier layer canimprove the adhesion between the bottom conductive line 130 and amaterial formed thereon (such as the bottom electrode 180), or prevent adiffusion of a metal from diffusing from the bottom electrode 180 intothe second dielectric layer 160. The barrier layer may include metalnitride materials. For example, the barrier layer includes Ta, TaN, orother suitable materials. In some embodiments, the barrier layerincludes a single layer or multiple layers. For a multiple-layerconfiguration, the layers include different compositions of metalnitride from each other.

In operation S30 of method M10 in FIG. 2B, the bottom electrode 180 isetched back, as shown in FIG. 3H. Specifically, the bottom electrode 180may, in some embodiments, be etched to a predetermined depth by, forexample, a selective dry etch. In some embodiments, the bottom electrode180 may be etched back such that the bottom electrode 180 is disposed inthe first bottom opening 162′ but separated from the second bottomopening 164′. That is, the bottom electrode 180 has a thickness 180 tlower than a difference of depths D3-D4 (see FIG. 3E). With suchconfiguration, the following formed bottom memory layer 190 has funnelshape that provide a good heating concentrating performance. Further,since the bottom electrode 180 is selectively etched back, the profileof the bottom opening BO substantially remains in this process.

In operation S32 of method M10 in FIG. 2B, a bottom memory materiallayer 190′ is formed over the bottom electrode 180 and in the bottomopening BO, as shown in FIG. 3I. Specifically, the bottom memorymaterial layer 190′ may be deposited over the structure of FIG. 3H(i.e., over the second dielectric layer 160 and the bottom electrode 180and filling the remaining bottom opening BO). In some embodiments, thebottom memory material layer 190′ may be deposited by physical vapordeposition (PVD), chemical vapor deposition (CVD), atomic layerdeposition (ALD) process, or other suitable process(es). When the bottommemory material layer 190′ is formed by performing the physical vapordeposition (PVD), the formed bottom memory material layer 190′ is dense.As such, the formed bottom memory layers 190 (see FIGS. 1 and 3J) indifferent memory cells have similar or the same density. Thisconfiguration improves the performance uniformity of the memory cells.Furthermore, the PVD provides a purified deposited layer (wellcomposition control), which improves the quality of the memory layer.Moreover, since the second bottom opening 164′ is wide, the profile ofthe bottom opening BO prevents the formation of seams or voids in thebottom memory material layer 190′.

In some embodiments, the memory device (see FIG. 1) includes PCRAMs, andthe bottom memory material layer 190′ of PCRAM may be a phase changingmaterial including chalcogenide alloy such as GeSbTe (GST).Alternatively, the bottom memory material layer 190′ may includeSi—Sb—Te alloys, Ga—Sb—Te alloys, As—Sb—Te alloys, Ag—In—Sb—Te alloys,Ge—In—Sb—Te alloys, Ge—Sb alloys, Sb—Te alloys, Si—Sb alloys, orcombinations thereof. The phase change materials have a crystallinestate with a low resistivity, and an amorphous state with a highresistivity.

In operation S34 of method M10 in FIG. 2B, a portion of the bottommemory material layer 190′ (see FIG. 3I) outside the bottom opening BOis removed to form bottom memory layer 190 in the bottom openings BO andover the bottom electrode 150, as shown in FIG. 3J. In some embodiments,the portion of the bottom memory material layer 190′ disposed over thesecond dielectric layer 160 is polished away in a planarization process.The planarization process may include a chemical-mechanical-polishing(CMP) process, for example. In this case, the second dielectric layer160 may serve as a polishing-stop layer for the planarization process.

In operation S36 of method M10 in FIG. 2B, a top memory layer 210 isformed over the bottom memory layer 190 and the second dielectric layer160, as shown in FIGS. 3K and 3L. Specifically, in FIG. 3K, a top memorymaterial layer 210′ is deposited over the structure of FIG. 3J (i.e.,over the second dielectric layer 160 and the bottom memory layer 190).In some embodiments, the memory device (see FIG. 1) includes PCRAMs, andthe top memory material layer 210′ of PCRAM may be a phase changingmaterial including chalcogenide alloy such as GeSbTe (GST).Alternatively, the top memory material layer 210′ may include Si—Sb—Tealloys, Ga—Sb—Te alloys, As—Sb—Te alloys, Ag—In—Sb—Te alloys,Ge—In—Sb—Te alloys, Ge—Sb alloys, Sb—Te alloys, Si—Sb alloys, orcombinations thereof. The phase change materials have a crystallinestate with a low resistivity, and an amorphous state with a highresistivity. In some embodiments, the top memory material layer 210′ andthe bottom memory material layer 190′ may have different or the samematerial(s).

The top memory material layer 210′ may be formed by a suitabletechnique, such as physical vapor deposition (PVD), such as a sputteringprocess with a metallic target and with a gas supply to the PVD chamber.Other chemical vapor deposition (CVD) techniques may be used. In anotherexample, the top memory material layer 210′ may be formed by atomiclayer deposition (ALD). In yet another example, the top memory materiallayer 210′ may be formed an electron-beam deposition process.

Reference is made to FIG. 3L. Next, the top memory material layer 210′is patterned to form a top memory layer 210. The patterning includes aphotolithography operation where a photoresist is deposited, a patternis defined by exposing photoresist to a radiation, and developing thephotoresist to create a photoresist pattern. The photoresist pattern isthen used as an etch mask to protect desired portions of the top memorymaterial layer 210′. The etch process stops when the second dielectriclayer 160 is reached. The top memory layer 210 is connected to thebottom memory layer 190.

In operation S38 of method M10 in FIG. 2B, a top electrode 230 is formedover the top memory layer 210, as shown in FIG. 3M. For example, a thirddielectric layer 220 is deposited over the structure of FIG. 3L (i.e.,over the top memory layer 210 and the second dielectric layer 160). Thethird dielectric layer 220 may include the same material as the seconddielectric layer 160 in some embodiments. The third dielectric layer 220may include, for example, silicon oxide, low-k silicon oxide such as aporous silicon oxide layer, other suitable dielectric material,combinations thereof, or the like.

In some embodiments, a damascene process is performed on the thirddielectric layer 220. Specifically, at least one top opening 222 formedin the third dielectric layer 220, then a top electrode 230 is formed inthe third dielectric layer 220. The top electrode 230 may be metal,metal-nitride (e.g., TiN), doped polysilicon, other suitable conductivematerial, combinations thereof, or the like. For example, the topelectrode 230 may be tantalum nitride, titanium nitride, platinum, othersuitable metal, combinations thereof, or the like.

In operation S40 of method M10 in FIG. 2B, a top conductive line 250 isformed over the top electrode 230, as shown in FIG. 3N. Specifically, afourth dielectric layer 240 (shown in FIG. 1) is deposited over thestructure of FIG. 3M (i.e., over the top electrode 230 and the thirddielectric layer 220). The fourth dielectric layer 240 may include thesame material as the second dielectric layer 160 in some embodiments.The fourth dielectric layer 240 may include, for example, silicon oxide,low-k silicon oxide such as a porous silicon oxide layer, other suitabledielectric material, combinations thereof, or the like.

In some embodiments, a damascene process is performed on the fourthdielectric layer 240. Specifically, a plurality of top line openings areformed in the fourth dielectric layer 240. After the formation, the topline openings respectively expose the top electrodes 230. The, fillingmaterial is formed in the top line openings. The filling material iselectrically connected to the top electrodes 230. Then, excessiveportion of the filling material is removed by performing a CMP processto form top conductive lines 250 respectively in the top line openings.The filling material may have similar or the same material as the bottomconductive lines 130.

FIG. 4 is an enlarged view of area P in FIG. 3N. Reference is made toFIGS. 3N and 4. The memory device includes a bottom electrode 180, abottom memory layer 190, a top memory layer 210, and a top electrode230. The bottom memory layer 190 is over the bottom electrode 180. Thetop memory layer 210 is over the bottom memory layer 190. The topelectrode 230 is over the top memory layer 210. The top memory layer 210covers the bottom memory layer 190. The bottom memory layer 190 has afunnel shape. That is, a top width Wa of the bottom memory layer 190 isgreater than a bottom width Wb of the bottom memory layer 190. Or, thebottom memory layer 190 tapers in a direction from the top memory layer210 toward the the bottom electrode 180. Stated in another way, thebottom memory layer 190 has a tapered portion 192 and a neck portion 194between the tapered portion 192 and the bottom electrode 180. Thetapered portion 192 is convex and tapers in a direction from the topmemory layer 210 toward the neck portion 194. During the memory(writing) operation, the current flows from the top electrode 230towards the bottom electrode 180 through the top memory layer 210 andthe bottom memory layer 190. The top memory layer 210 has a firstthermal resistance R1, the tapered portion 192 of the bottom memorylayer 190 has a second thermal resistance R2, and the neck portion 194of the bottom memory layer 190 has a third thermal resistance R3. Sincethe neck portion 194 has the smallest width, R3>R2>R1. The currentdensity is increased in the neck portion 194 of the bottom memory layer190, and the neck portion 194 is the hottest region among the memorylayers. As such, the heat generated from the current is concentrated inthe neck portion 194 of the bottom memory layer 190 and the neck portion194 is the programmable region for phase changing. The concentrated heatin the neck portion 194 of the bottom memory layer 190 lowers thethreshold voltage for the memory operation, and the write current of thememory device can be reduced. As such, the size of the memory cell canbe reduced. Further, since the bottom electrode 180 is formed in thebottom opening BO, which has a small CD, the write current can befurther reduced.

The bottom memory layer 190 inherits the profile of the bottom openingBO. In greater detail, a width Wb of the neck portion 194 is less than awidth Wa of the tapered portion 192. The width Wa of the tapered portion192 is reduced downwardly. In some embodiments, the maximum value of thewidth Wa may be in a range of about 50 nm to about 300 nm. If themaximum value of width Wa is less than about 50 nm, the first bottomopening 162 (see FIG. 3D) may not be widened, and the bottom memorylayer 190 may not be a funnel shape. If the width Wa is greater thanabout 300 nm, the layout area of each memory cell may be increased. Thetapered portion 192 of the bottom memory layer 190 has a height 192 h,and the bottom memory layer 190 has a height 190 h. A ratio of theheights 192 h/190 h is in a range of about 0.2 to about 0.5. If theheight ratio is lower than about 0.2, the bottom memory material layer190′ (see FIG. 3I) is not easy to fill the bottom opening BO, and seamsand/or voids may be formed in the bottom memory layer 190. If the heightratio is higher than about 0.5, the heat is not easy to be concentratedin the neck portion 194. In some embodiments, a sidewall 192 s of thetapered portion 192 is curved, e.g., convex in this case. Also, asidewall 160S of the dielectric layer 160 facing the bottom memory layer190 is curved, e.g., concave in this case. On the other hand, a sidewall194 s of the neck portion 194 is substantially straight or vertical. Anangle θa is formed at the interface between the sidewall 192 s and thesidewall 194 s, and the angle θa may be an obtuse angle. In someembodiments, the angle θa may be in a range from about 90 degrees toabout 135 degrees. Further, another angle θb is formed at the interfaceof the top surface 192 t and the sidewall 192 s of the tapered portion192, and the angle θb may be an acute angle. In some embodiments, theangle θb may be in a range from about 45 degrees to about 90 degrees.The bottom electrode 180 has a sidewall 180 s. Since the bottomelectrode 180 and the bottom memory layer 190 are both formed in thebottom opening BO, the sidewall 180 s of the bottom electrode 180 andthe sidewall 194 s of the neck portion 194 are coterminous. Also, theneck portion 194 and the bottom electrode 180 have substantially thesame width. The memory device further includes a polymer layer 170between the second dielectric layer 160 and the bottom memory layer 190.The polymer layer 170 surrounds the bottom memory layer 190 and thebottom electrode 180.

FIG. 5 is a cross-sectional view of a memory device according to someembodiments, and FIG. 6 is an enlarged view of area N in FIG. 5.Reference is made to FIGS. 5 and 6. The difference between the memorydevices in FIGS. 5 and 3N pertains to the shape of the bottom memorylayer 190 (i.e., the profile of the bottom opening BO). In FIGS. 5 and6, the bottom memory layer 190 also has a funnel shape. In greaterdetail, the bottom memory layer 190 has a tapered portion 192′ and aneck portion 194 between the tapered portion 192′ and the bottomelectrode 180. A width Wb of the neck portion 194 is less than a widthWa′ of the tapered portion 192′. The width Wa′ of the tapered portion192′ is reduced downwardly. The tapered portion 192 is concave. In someembodiments, the maximum value of the width Wa′ may be in a range ofabout 50 nm to about 300 nm. If the maximum value of width Wa′ is lessthan about 50 nm, the first bottom opening 162 (see FIG. 3D) may not bewidened, and the bottom memory layer 190 may not be a funnel shape. Ifthe width Wa′ is greater than about 300 nm, the layout area of eachmemory cell may be increased. In some embodiments, a sidewall 192 s′ ofthe tapered portion 192′ is curved, e.g., concave in this case. Also, asidewall 160S of the dielectric layer 160 facing the bottom memory layer190 is curved, e.g., convex in this case. The tapered portion 192′ ofthe bottom memory layer 190 has a height 192 h′, and the bottom memorylayer 190 has a height 190 h. A ratio of the heights 192 h′/190 h is ina range of about 0.2 to about 0.5. If the height ratio is lower thanabout 0.2, the bottom memory material layer 190′ (see FIG. 3I) is noteasy to fill the bottom opening BO, and seams and/or voids may be formedin the bottom memory layer 190. If the height ratio is higher than about0.5, the heat is not easy to be concentrated in the neck portion 194. Onthe other hand, a sidewall 194 s of the neck portion 194 issubstantially straight or vertical. An angle θa′ is formed at theinterface between the sidewall 192 s′ and the sidewall 194 s, and theangle θa′ may be an obtuse angle. In some embodiments, the angle θa′ maybe in a range from about 135 degrees to about 180 degrees. Further,another angle θb′ is formed at the interface of the top surface 192 t′and the sidewall 192 s′ of the tapered portion 192, and the angle θb′may be an acute angle. In some embodiments, the angle θb′ may be in arange from about 0 degrees to about 45 degrees. The bottom electrode 180has a sidewall 180 s. Since the bottom electrode 180 and the bottommemory layer 190 are both formed in the bottom opening BO, the sidewall180 s of the bottom electrode 180 and the sidewall 194 s of the neckportion 194 are coterminous. Also, the neck portion 194 and the bottomelectrode 180 have substantially the same width.

The profile of the tapered portion 192′ (and the profile of the bottomopening BO) attributes to the etching gas in the operation S24 (i.e.,patterning the etch stop layer 150). In this case, the selectivelyetching process may be a dry etching process using etching gases such asC₄F₈, C₄F₆, combinations thereof, or the like. In some otherembodiments, Ar, He, or other suitable gases may be added into theetching process. The etching period may be in a range of about 20seconds to about 100 seconds. If the etching period is lower than about20 seconds, the etch stop layer 150 may not be etched to the bottom. Ifthe etching period is greater than about 100 seconds, the etch stoplayer 150 may be over etched. In some embodiments, the amount of C₄F₆gas is greater than the amount of C₄F₈ gas to obtain the second bottomopening 164 having a concave downward sidewall. In other words, the gasratio of C₄F₈/C₄F₆ is lower than about 1 in this case. Since the otherstructural and/or manufacturing details of the memory device in FIG. 5are similar to the memory device in FIGS. 3A-3N, the detaileddescription is not repeated herein.

FIGS. 7A and 7B are a flowchart of a method M10′ for making a memorydevice according to aspects of the present disclosure in variousembodiments. Various operations of the method M10′ are discussed inassociation with perspective diagrams FIGS. 8A-81. Throughout thevarious views and illustrative embodiments, like reference numbers areused to designate like elements. The present embodiment may repeatreference numerals and/or letters used in FIGS. 3A-3N. This repetitionis for the purpose of simplicity and clarity and does not in itselfdictate a relationship between the various embodiments and/orconfigurations discussed. In the following embodiments, the structuraland material details described before are not repeated hereinafter, andonly further information is supplied to perform the memory devices ofFIGS. 8A-81. In operation S12 of method M10′ of FIG. 7A, a wafer 110including a substrate 112 and a circuit 114 formed over the substrate112 is provided, as shown in FIG. 8A. In operation S14 of method M10′ ofFIG. 7A, at least one IMD layer 120 is formed over the wafer 110, asshown in FIG. 8A. In operation S16 of method M10′ of FIG. 7A, at leastone bottom conductive line 130 is formed over the IMD layer 120, asshown in FIG. 8A. In operation S18 of method M10′ of FIG. 7A, an etchstop layer 150 and a second dielectric layer 160 are sequentially formedover the bottom conductive line 130 and the first dielectric layer 140,as shown in FIG. 8A. In operation S20 of method M10′ of FIG. 7A, atleast one first bottom opening 162 is formed in the second dielectriclayer 160, as shown in FIG. 8A. The first bottom opening 162 has a depthD1 and a width W1. Sharp corners 169 are formed at the interface betweenthe top surface of the second dielectric layer 160 and a sidewall of thefirst bottom opening 162.

In operation S22 of method M10′ in FIG. 7A, at least one second bottomopening 164 is formed over the first bottom opening 162, as shown inFIG. 8B. In other words, top portions of the first bottom openings 162are widened, and/or the sharp corner 169 (see FIG. 8A) is removed orrounded. Specifically, a photoresist trimming process is performed onthe photoresist PR1 to widen the opening O1′. Then, the exposed portionsof the second dielectric layer 160 are then patterned (etched) to formsecond bottom openings 164 over the first bottom openings 162. Duringthis operation, the first bottom openings 162 are deepened but still areblind holes. That is, the depth D1′ of the first bottom opening 162 isgreater than the depth D1 in FIG. 8A and is still less than thethickness 160 t of the second dielectric layer 160. The second bottomopenings 164 may be formed by performing an etching process, such as dryetching, wet etching, or combinations thereof. In some embodiments, theetching process is a dry etching process using etching gases as CH₂F₂and/or HBr. Further, He may be added in the etching gases in someembodiments.

In greater detail, the second bottom opening 164 overlaps the firstbottom opening 162. The first bottom opening 162 has a width W1′ and adepth D1′. The width W1′ is substantially the same as the width W1 inFIG. 8A, and the depth D1′ is greater than the depth D1 in FIG. 8A andis less than the thickness 160 t of the second dielectric layer 160. Thesecond bottom opening 164 has a width W2 and a depth D2. The width W2 ofthe second bottom opening 164 is greater than the width W1′ of the firstbottom opening 162, and the depth D2 of the second bottom opening 164 isless than the depth D1′ of the first bottom opening 162.

In operation S23 of method M10 in FIG. 7A, at least one third bottomopening 166 is formed over the second bottom opening 164, as shown inFIG. 8C. In other words, top portions of the second bottom openings 164are widened. Specifically, a photoresist trimming process is performedon the photoresist PR1 to widen the opening O1″. In some embodiments,the photoresist trimming process may be an etching process. As such, theopening O1″ further exposes another portion of the top surface of thesecond dielectric layer 160. Then, the exposed portions of the seconddielectric layer 160 are then patterned (etched) to form third bottomopenings 166 over the second bottom openings 164. During this operation,the first and second bottom openings 162 and 164 are deepened, and thefirst bottom opening 162 exposes the etch stop layer 150. The thirdbottom openings 166 may be formed by performing an etching process, suchas dry etching, wet etching, or combinations thereof. In someembodiments, the etching process is a dry etching process using etchinggases as CH₂F₂ and/or HBr. Further, He may be added in the etching gasesin some embodiments.

In greater detail, the third bottom opening 166 overlaps the secondbottom opening 164. The first bottom opening 162 has a width W1″ and adepth D1″. The width W1″ is substantially the same as the width W1 inFIG. 8A, and the depth D1″ is greater than the depth D1′ in FIG. 8B andis substantially the same as the thickness 160 t of the seconddielectric layer 160. The second bottom opening 164 has a width W2′ anda depth D2′. The width W2′ of the second bottom opening 164 is greaterthan the width W1″ of the first bottom opening 162, and the depth D2′ ofthe second bottom opening 164 is less than the depth D1″ of the firstbottom opening 162. The third bottom opening 166 has a width W3 and adepth D3. The width W3 of the third bottom opening 166 is greater thanthe width W2′ of the second bottom opening 164, and the depth D3 of thethird bottom opening 166 is less than the depth D2′ of the second bottomopening 164.

The following manufacturing process of the method M10′ is similar to themethod M10. For example, in operation S24 of method M10′ in FIG. 7A, theetch stop layer 150 is patterned to expose the bottom conductive line130, as shown in FIG. 8D. In some embodiments, the etching gas includesC₄F₈, C₄F₆, combinations thereof, or the like. The amount of C₄F₈ gas isgreater than the amount of C₄F₆ gas to obtain the second and thirdbottom openings 164 and 166 having a concave upward sidewall. In otherwords, the gas ratio of C₄F₈/C₄F₆ is greater than about 1 in this case.In FIG. 8D, the first, second, and third bottom openings 162′, 164′, and166′ are together referred to as the bottom opening BO, which is funnelshaped.

In operation S26 of method M10′ in FIG. 7B, a surface cleaning processis performed in the bottom opening BO, as shown in FIG. 8E. In operationS28 of method M10′ in FIG. 7B, a bottom electrode 180 is formed in thebottom opening BO, and in operation S30 of method M10′ in FIG. 8B, thebottom electrode 180 is etched back, as shown in FIG. 8F. In operationS32 of method M10′ in FIG. 7B, a bottom memory material layer is formedover the bottom electrode 180 and in the bottom opening BO, and inoperation S34 of method M10′ in FIG. 7B, a portion of the bottom memorymaterial layer outside the bottom opening BO is removed to form bottommemory layer 190 in the bottom openings BO and over the bottom electrode150, as shown in FIG. 8G. In operation S36 of method M10′ in FIG. 7B, atop memory layer 210 is formed over the bottom memory layer 190 and thesecond dielectric layer 160, as shown in FIG. 8H. In operation S38 ofmethod M10′ in FIG. 7B, a top electrode 230 is formed over the topmemory layer 210, and in operation S40 of method M10′ in FIG. 7B, a topconductive line 250 is formed over the top electrode 230, as shown inFIG. 8I.

FIG. 9 is an enlarged view of area P′ in FIG. 8I. Reference is made toFIGS. 8I and 9. The memory device includes a bottom electrode 180, abottom memory layer 190, a top memory layer 210, and a top electrode230. The bottom memory layer 190 is over the bottom electrode 180. Thetop memory layer 210 is over the bottom memory layer 190. The topelectrode 230 is over the top memory layer 210. The top memory layer 210covers the bottom memory layer 190. The bottom memory layer 190 has afunnel shape. That is, a top width We of the bottom memory layer 190 isgreater than a bottom width Wd of the bottom memory layer 190. Or, thebottom memory layer 190 tapers in a direction from the top memory layer210 toward the bottom electrode 180. Stated in another way, the bottommemory layer 190 has a first tapered portion 192, a second taperedportion 196, and a neck portion 194. The second tapered portion 196 isbetween the first tapered portion 192 and the neck portion 194, and theneck portion 194 is between the second tapered portion 196 and thebottom electrode 180. During the memory (writing) operation, the currentflows from the top electrode 230 towards the bottom electrode 180through the top memory layer 210 and the bottom memory layer 190. Thetop memory layer 210 has a first thermal resistance R1, the firsttapered portion 192 of the bottom memory layer 190 has a second thermalresistance R2, the second tapered portion 196 of the bottom memory layer190 has a third thermal resistance R3, and the neck portion 194 of thebottom memory layer 190 has a fourth thermal resistance R4. Since theneck portion 194 has the smallest width, R4>R3>R2>R1. The currentdensity is increased in the neck portion 194 of the bottom memory layer190, and the neck portion 194 is the hottest region among the memorylayers. As such, the heat generated from the current is concentrated inthe neck portion 194 of the bottom memory layer 190 and the neck portion194 is the programmable region for phase changing. The concentrated heatin the neck portion 194 of the bottom memory layer 190 lowers thethreshold voltage for the memory operation, and the write current of thememory device can be reduced. As such, the size of the memory cell canbe reduced. Further, since the bottom electrode 180 is formed in thebottom opening BO, which has a small CD, the write current can befurther reduced.

The bottom memory layer 190 inherits the profile of the bottom openingBO. In greater detail, a width Wd of the neck portion 194 is less thanwidths Wc, We of the first and the second tapered portion 192 and 196.The widths Wc and We of the first and second tapered portion 192 and 196are both reduced downwardly. In some embodiments, the maximum value ofthe width Wc may be in a range of about 50 nm to about 300 nm. If themaximum value of width Wc is less than about 50 nm, the first bottomopening 162 (see FIG. 8A) may not be widened, and the bottom memorylayer 190 may not be a funnel shape. If the width Wc is greater thanabout 300 nm, the layout area of each memory cell may be increased. Thefirst and second tapered portions 192 and 196 of the bottom memory layer190 have a height 192 h, and the bottom memory layer 190 has a height190 h. A ratio of the heights 192 h/190 h is in a range of about 0.2 toabout 0.5. If the height ratio is lower than about 0.2, the bottommemory material layer 190′ (see FIG. 3I) is not easy to fill the bottomopening BO, and seams and/or voids may be formed in the bottom memorylayer 190. If the height ratio is higher than about 0.5, the heat is noteasy to be focused in the neck portion 194. In some embodiments, asidewall 192 s of the first tapered portion 192 is curved, e.g., convexin this case; and a sidewall 196 s of the second tapered portion 196 iscurved, e.g., convex in this case. In some embodiments, the curvaturesof the sidewalls 192 s and 196 s are different. Also, a sidewall 160S ofthe dielectric layer 160 facing the bottom memory layer 190 is curved,e.g., concave in this case. On the other hand, a sidewall 194 s of theneck portion 194 is substantially straight or vertical. An angle θc isformed at the interface between the sidewall 196 s and the sidewall 194s, and the angle θc is an obtuse angle. In some embodiments, the angleθc may be in a range from about 90 degrees to about 135 degrees.Further, another angle θd is formed at the interface of the top surface192 t and the sidewall 192 s of the tapered portion 192, and the angleθd may be an acute angle. In some embodiments, the angle θd may be in arange from about 45 degrees to about 90 degrees. The bottom electrode180 has a sidewall 180 s. Since the bottom electrode 180 and the bottommemory layer 190 are both formed in the bottom opening BO, the sidewall180 s of the bottom electrode 180 and the sidewall 194 s of the neckportion 194 are coterminous. Also, the neck portion 194 and the bottomelectrode 180 have substantially the same width. The memory devicefurther includes a polymer layer 170 between the second dielectric layer160 and the bottom memory layer 190. The polymer layer 170 surrounds thebottom memory layer 190 and the bottom electrode 180.

FIG. 10 is a cross-sectional view of a memory device according to someembodiments, and FIG. 11 is an enlarged view of area N′ in FIG. 10.Reference is made to FIGS. 10 and 11. The difference between the memorydevices in FIGS. 10 and 81 pertains to the shape of the bottom memorylayer 190 (i.e., the profile of the bottom opening BO). In FIGS. 10 and11, the bottom memory layer 190 also has a funnel shape. In greaterdetail, the bottom memory layer 190 has a first tapered portion 192′, asecond tapered portion 196′, and a neck portion 194. The second taperedportion 196′ is between the first tapered portion 192′ and the neckportion 194, and the neck portion 194 is between the second taperedportion 196′ and the bottom electrode 180. A width Wd′ of the neckportion 194 is less than widths Wc′ and We′ of the first and secondtapered portions 192′ and 196′. The widths Wc′ and We′ of the first andsecond tapered portion 192′ and 196′ are both reduced downwardly. Insome embodiments, the maximum value of the width Wc′ may be in a rangeof about 50 nm to about 300 nm. If the maximum value of width Wc′ isless than about 50 nm, the first bottom opening 162 (see FIG. 8A) maynot be widened, and the bottom memory layer 190 may not be a funnelshape. If the width Wc′ is greater than about 300 nm, the layout area ofeach memory cell may be increased. In some embodiments, a sidewall 192s′ of the first tapered portion 192′ is curved, e.g., concave in thiscase; and a sidewall 196 s′ of the second tapered portion 196′ iscurved, e.g., concave in this case. In some embodiments, the curvaturesof the sidewalls 192 s and 196 s are different. Also, a sidewall 160S ofthe dielectric layer 160 facing the bottom memory layer 190 is curved,e.g., convex in this case. The first and second tapered portion 192′ and196′ of the bottom memory layer 190 has a height 192 h′, and the bottommemory layer 190 has a height 190 h. A ratio of the heights 192 h′/190 his in a range of about 0.2 to about 0.5. If the height ratio is lowerthan about 0.2, the bottom memory material layer 190′ (see FIG. 3I) isnot easy to fill the bottom opening BO, and seams and/or voids may beformed in the bottom memory layer 190. If the height ratio is higherthan about 0.5, the heat is not easy to be focused in the neck portion194. On the other hand, a sidewall 194 s of the neck portion 194 issubstantially straight or vertical. An angle θc′ is formed at theinterface between the sidewall 196 s′ and the sidewall 194 s, and theangle θc′ may be an obtuse angle. In some embodiments, the angle θc′ maybe in a range from about 135 degrees to about 180 degrees. Further,another angle θd′ is formed at the interface of the top surface 192 t′and the sidewall 192 s′ of the tapered portion 192, and the angle θd′may be an acute angle. In some embodiments, the angle θd′ may be in arange from about 0 degrees to about 45 degrees. The bottom electrode 180has a sidewall 180 s. Since the bottom electrode 180 and the bottommemory layer 190 are both formed in the bottom opening BO, the sidewall180 s of the bottom electrode 180 and the sidewall 194 s of the neckportion 194 are coterminous. Also, the neck portion 194 and the bottomelectrode 180 have substantially the same width.

The profile of the first and second tapered portion 192′ and 196′ (andthe profile of the bottom opening BO) attributes to the etching gas inthe operation S24 (i.e., patterning the etch stop layer 150). In thiscase, the selectively etching process may be a dry etching process usingetching gases such as C₄F₈, C₄F₆, combinations thereof, or the like. Insome other embodiments, Ar, He, or other suitable gases may be addedinto the etching process. The etching period may be in a range of about20 seconds to about 100 seconds. If the etching period is lower thanabout 20 seconds, the etch stop layer 150 may not be etched to thebottom. If the etching period is greater than about 100 seconds, theetch stop layer 150 may be over etched. In some embodiments, the amountof C₄F₆ gas is greater than the amount of C₄F₈ gas to obtain the secondand third bottom opening 164 and 166 having a concave downward sidewall.In other words, the gas ratio of C₄F₈/C₄F₆ is lower than about 1 in thiscase. Since the other structural and/or manufacturing details of thememory device in FIG. 10 are similar to the memory device in FIGS.8A-81, the detailed description is not repeated herein.

According to some embodiments, a phase change memory device includes abottom electrode, a bottom memory layer, a top memory layer, and a topelectrode. The bottom memory layer is over the bottom electrode. Thebottom memory layer has a first height and includes a tapered portionand a neck portion. The tapered portion has a second height. A ratio ofthe second height to the first height is in a range of about 0.2 toabout 0.5. The neck portion is between the tapered portion and thebottom electrode. The top memory layer is over the bottom memory layer.The tapered portion of the bottom memory layer tapers in a directionfrom the top memory layer toward the neck portion. The top electrode isover the top memory layer.

According to some embodiments, a phase change memory device includes adielectric layer, a bottom electrode, a bottom memory layer, a topmemory layer, and a top electrode. The bottom memory layer is over thebottom electrode and in the dielectric layer. The bottom memory layerhas a funnel shape. A top width of the bottom memory layer is greaterthan a width of the bottom electrode. The top width of the bottom memorylayer is in a range of about 50 nm to about 300 nm. The top memory layeris over the bottom memory layer. The top electrode is over the topmemory layer.

According to some embodiments, a method for manufacturing a phase changememory device includes forming a dielectric layer over a substrate. Afirst opening is formed in the dielectric layer. A second opening isformed to overlap the first opening in the dielectric layer. The secondopening is wider than the first opening and the first opening is deeperthan the second opening. A bottom electrode is formed in the firstopening of the dielectric layer. A bottom memory layer is formed in thefirst opening and the second opening of the dielectric layer and overthe bottom electrode. A top electrode is formed over the bottom memorylayer.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

1-13. (canceled)
 14. A method for manufacturing a phase change memorydevice, comprising: forming a dielectric layer over a substrate; forminga first opening in the dielectric layer; forming a second openingoverlapping the first opening in the dielectric layer, wherein thesecond opening is wider than the first opening and the first opening isdeeper than the second opening; forming a bottom electrode in the firstopening of the dielectric layer; forming a bottom memory layer in thefirst opening and the second opening of the dielectric layer and overthe bottom electrode; and forming a top electrode over the bottom memorylayer.
 15. (canceled)
 16. The method of claim 14, further comprisingdeepening the first opening and the second opening.
 17. The method ofclaim 16, further comprising tuning a profile of the second opening bydetermining a gas ratio of etching gases when deepening the firstopening and the second opening.
 18. The method of claim 14, furthercomprising performing a surface cleaning treatment on the first openingand the second opening.
 19. The method of claim 14, further comprisingforming a polymer layer in the first opening and the second opening. 20.The method of claim 14, further comprising forming a top memory layer onthe bottom memory layer and the dielectric layer, and the top electrodeis formed on the top memory layer.
 21. The method of claim 17, whereinthe etching gases comprises C₄F₈, C₄F₆, or combinations thereof.
 22. Amethod for manufacturing a phase change memory device, comprising:forming a conductive line above a substrate; forming a dielectric layerover the conductive line; forming a first opening in the dielectriclayer, wherein a depth of the first opening is less than a depth of thedielectric layer; forming a second opening in the dielectric layer whiledeepen the depth of the first opening, such that a combination of thefirst and second openings form a funnel shape; deepening the depth ofthe first opening to expose the conductive line; tuning a profile of thesecond opening by using etching gases comprising C₄F₈/C₄F₆; forming abottom electrode in the first opening; forming a bottom memory layer inthe first opening and the second opening of the dielectric layer andover the bottom electrode; and forming a top electrode over the bottommemory layer.
 23. The method of claim 22, wherein an amount of C₄F₈ gasis greater than an amount of C₄F₆ gas.
 24. The method of claim 22,wherein an etching period of tuning the profile of the second opening isin a range of about 20 seconds to about 100 seconds.
 25. The method ofclaim 22, further comprising adding Ar or He to tune the profile of thesecond opening.
 26. The method of claim 22, further comprising forming atop memory layer on the bottom memory layer prior to forming the topelectrode.
 27. The method of claim 26, wherein the top memory layer isformed such that the top memory layer is wider than the bottom memorylayer.
 28. The method of claim 22, wherein the bottom memory layer isformed by performing a PVD process.
 29. The method of claim 22, whereinthe bottom memory layer comprises chalcogenide alloy, Si—Sb—Te alloys,Ga—Sb—Te alloys, As—Sb—Te alloys, Ag—In—Sb—Te alloys, Ge—In—Sb—Tealloys, Ge—Sb alloys, Sb—Te alloys, Si—Sb alloys, or combinationsthereof.
 30. A method for manufacturing a phase change memory device,comprising: forming a conductive line above a substrate; forming anetching stop layer above the conductive line forming a dielectric layerabove the etching stop layer; forming a first opening in the dielectriclayer, wherein the first opening does not expose the etching stop layer;forming a second opening above the first opening and in the dielectriclayer such that the first opening exposes the etching stop layer;patterning the etching stop layer to expose the conductive line, whereinpatterning the etching stop layer is performed with a first removal rateRR1 of the etching stop layer, a second removal rate RR2 of thedielectric layer, a third removal rate RR3 of the conductive line, andRR1>RR2>RR3; forming a memory layer in the first and second openings;and forming a top electrode above the memory layer.
 31. The method ofclaim 30, wherein RR1/RR2 is in a range of about 10 to about
 100. 32.The method of claim 30, wherein RR1/RR3 is in a range of about 100 toabout
 1000. 33. The method of claim 30, further comprising forming apolymer layer on the dielectric layer at sidewalls of the first andsecond openings.
 34. The method of claim 33, wherein the polymer layercomprises SiClO_(x), SiBrO_(x), CH_(x), or combinations thereof.